The company has already announced that Intel is working on processor packages with integrated LPDDR memory. Over X leaked presentation slides are now revealing details about planned systems: Intel will introduce the packages with integrated memory at the latest with Lunar Lake, the successor to the not yet released Meteor Lake mobile processors. This was the chip shown in September.
Intel developed the system-on-chip (SoC) together with Microsoft; they can be cooled both passively and actively. With active cooling, the TDP can be set between 17 and 30 watts; fanless devices are limited to 8 watts. At least according to the leaked slides, only four variants are planned: The Core7 MS3 and the Core5 MS1, each of which will be released with 16 or 32 GB of LPDDR5-8533 memory connected to two memory channels. Both are a 4+4 design (4 P and 4 E cores) with Lion Cove and Skymont architecture. The so-called system level cache is 8 MB in size.
Although according to the slides it is a Foveros die, i.e. several individual silicon dies put together, Intel seems to integrate the graphics unit into the CPU die. Xe2 cores (Battlemage) should be used, the Core7 gets eight of them, the Core5 only 7. The situation is similar with the integrated AI accelerator (Neural Processing Unit, NPU): The Core7 gets six tiles, the Core5 only five.
The IO controllers, however, are located on a separate SoC die: In addition to 4 PCIe 5.0 and 4 PCIe 4.0 lanes, three USB4/Thunderbolt4 ports with 40 Gbit/s and two USB3 ports with 10 Gbit/s are available . A Wi-Fi 7 module is also integrated into the package. The classification of the GPU performance shows which segment Lunar Lake is targeting: According to the slides, it should be comparable to Apple’s M2 with 12 watt TDP. The Lunar Lake CPUs will therefore be found in high-priced, compact systems. They are unlikely to come onto the market until the second half of 2024 at the earliest; an old roadmap envisaged them for 2025 (g+).